Grow into the Future by Embracing Digital Technology

SAP and T.A. Cook are delighted to announce that the International SAP Conference for Forest Products, Paper, and Packaging will be arriving in Prague, October 16-18, 2018. 


The two-day conference will attract business and IT-focused attendees representing a diverse set of companies including those active in wood, timber, panels, particleboards, commodity paper, specialty paper, paper packaging, flexible packaging, and metals packaging businesses.


The conference will demonstrate how businesses are using the newest technologies such as the Internet of Things (IoT), automation, mobile technology, and the cloud to  to drive new revenue, improve margins and supplier relationships, increase productivity and asset performance, and reduce downtime. Global SAP Customers, SAP Experts and thought leaders will join together and showcase how SAP is helping to the FPPP industries grow into the future. 

 

The 2018 event will also be co-located with three other industry events:

  • International SAP Conference for Chemicals
  • International SAP Conference for Mining & Metals 
  • International SAP Conference for Building Materials

Delegates will have the opportunity to move freely between all four events and benefit from cross-industry workshops, keynote presentations, tracks and partner exhibition. If you'd like to be involved in this event series please contact info@tacook.com. We have speaker, sponsor and media partner opportunities available.